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FAA60000361:   Expedition PCB Advanced

FAA60000361 Active
Expedition PCB Advanced
COURSE 2018-08-15
This course includes IC packaging, MCM/Hybrid Design and Mixed signal SiP design. 3D Wire bonding, Chip Stacking, substrate cavities as well as integral embedded passives are supported in this flow and covered in this class.
AJW-C AJV-C
BLENDED 24.0
Prerequisites

 

D O T Triskelion

U.S. Department of Transportation

Federal Aviation Administration

800 Independence Avenue, SW

Washington, DC 20591

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