FAA60000361: Expedition PCB Advanced
FAA60000361 | Active | ||
Expedition PCB Advanced | |||
COURSE | 2018-08-15 | ||
This course includes IC packaging, MCM/Hybrid Design and Mixed signal SiP design. 3D Wire bonding, Chip Stacking, substrate cavities as well as integral embedded passives are supported in this flow and covered in this class. | |||
AJW-C | AJV-C | ||
BLENDED | 24.0 | ||
Prerequisites |