FAA60000361: Expedition PCB Advanced
| FAA60000361 | Active | ||
| Expedition PCB Advanced | |||
| COURSE | 2018-08-15 | ||
| This course includes IC packaging, MCM/Hybrid Design and Mixed signal SiP design. 3D Wire bonding, Chip Stacking, substrate cavities as well as integral embedded passives are supported in this flow and covered in this class. | |||
| AJW-C | AJV-C | ||
| BLENDED | 24.0 | ||
| Prerequisites | |||
